The Problem
PCB damage during production and in field trials, and low mechanical strength of the molded PCB.
The Challenge
Achieving high adhesion and flexural strength at low pressure and temperature conditions.
Our Approach
We moved beyond standard techniques to create an innovative LTLP encapsulation method.
Our Process
We started by understanding manufacturing constraints, then tested various tooling solutions using advanced composite materials. Our adaptable tooling design reduced expenses by enabling the same tools and methodology for prototypes, limited quantities, and larger production runs.
Our Work
We developed a proprietary Low Temperature Low Pressure encapsulation for live PCBs, then diversified into optical encapsulation and transparent housing solutions for light guides, lensing, and diffusion applications.
The Result
TMUs created via the LTLP encapsulation process completed demanding field trials including drum testing successfully. Production is now active, and the solution enabled Bosch to accelerate market entry using our rapid industrialization approach.