A case story of achieving Tyre Management Unit (TMU) encapsulation under thermal and barometric constraints
The Problem
PCB damage during production & in field trials and low mechanical strength of molded PCB.
The Challenge
Achieving high adhesion and flexural strength at low pressure and temperature conditions.
Our Approach
We looked beyond conventional methods and devised novel methods to invent LTLP encapsulation process.
Our Process
We started with the understanding of boundary conditions for manufacturing. We innovated on the process and focused on the identification & trials of various tooling options with advanced composite materials.
Our versatile tooling greatly enhanced cost effectiveness by allowing the usage of same tooling and process for prototypes, small batches & volume batch production.
Our Work
We built our proprietary LTLP
(Low Temperature Low Pressure) encapsulation for live PCBs and have now expanded into optical encapsulation & clear case solutions for lensing, diffusion and light guides.
The Result
The encapsulated TMUs manufactured through our proprietary LTLP encapsulation process successfully passed rigorous field trials including drum tests. We are now in active production. This solution helped our partner Bosch take the product to market in a timely manner through our rapid industrialization methodology.